Print Circult Board

US$7.30-9.50 / Piece

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Red Solder Mask Single, Double Side and Multi-Layer PCB Board From 1-30 Layer pictures & photos

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What is Red Solder Mask Single, Double Side and Multi-Layer PCB Board From 1-30 Layer

Name: Red Solder Mask Single, Double Side and Multi-Layer PCB Board From 1-30 Layer
Uploaded: 2023-11-03T17:40:36+08:00
Description: Product De Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm M

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$7.30-9.50 / Piece

Sepcifications

Structure Rigid PCB
Dielectric FR-4
Material Fr4
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process HASL Lf, Plating. Gold, Immersion Gold, Silver
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Not Specified
Transport Package by Vacuum Packing in Cartons
Trademark KMC
Origin Shenzhen
Material Type Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
Layer Counts 4--30
Board Thickness 0.2mm--6.0mm
Fished Outer Copper 1oz--5oz
Minimum Trace Width 3/4mil
Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;

Product Description

Product De Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 ...

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Keep Moving Circuits Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products Multilayer PCB, Flexible PCB, HDI PCB, LED PCB, PCBA, PCB+ Assembly, Rigid-Flex PCB, Double Sided PCB, High Frequency PCB, Alunimium PCB
Registered Capital 20000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Print Circult Board Comparison

	Quick View Red Solder Mask Single, Double Side and Multi-Layer PCB Board From 1-30 Layer Contact Now	New Products Highspeed Material and High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Direct Manufacturer China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB Contact Now	New Products High Frequency Ccl Material and High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Direct Manufacturer Phenolic Paper Based Copper Clad Laminate Phenolic Paper Tsdf-1220W-GS08 Copper Clad Laminate Fiberglass PCB Ccl Sheet Contact Now

Transaction Info
	Quick View Red Solder Mask Single, Double Side and Multi-Layer PCB Board From 1-30 Layer Contact Now	New Products Highspeed Material and High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Direct Manufacturer China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB Contact Now	New Products High Frequency Ccl Material and High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Direct Manufacturer Phenolic Paper Based Copper Clad Laminate Phenolic Paper Tsdf-1220W-GS08 Copper Clad Laminate Fiberglass PCB Ccl Sheet Contact Now
Price	US $ 7.30-9.50/ Piece	Negotiable	Negotiable	Negotiable	Negotiable
Min Order	1 Pieces	50 Square Meters	50 Square Meters	50 Square Meters	50 Square Meters
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe
Annual Export Revenue	-	> US $100 Million	> US $100 Million	> US $100 Million	> US $100 Million
Business Model	OEM, Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Rigid PCB; Dielectric: FR-4; Material: Fr4; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: HASL Lf, Plating. Gold, Immersion Gold, Silver; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Not Specified; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 4--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;
Supplier Name	Keep Moving Circuits Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.
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