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US$5.60-7.30 / Piece

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Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias pictures & photos

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What is Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias

Name: Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias
Uploaded: 2023-12-26T17:14:52+08:00
Description: Product Detail Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0

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Price

Min. Order Reference FOB Price

1 Piece US$5.60-7.30 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package by Vacuum Packing in Cartons
Trademark KMC
Origin Shenzhen
Material Type Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
Layer Counts 1--30
Board Thickness 0.2mm--6.0mm
Fished Outer Copper 1oz--5oz
Minimum Trace Width 3mil/4mil
Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;
Certificates UL, RoHS, SGS, ISO9001 ISO14000
PCB Testing E-Testing; Flying Probe Testing
Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Product Detail Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 ...

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Keep Moving Circuits Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCBA, PCB+Assembly, FPC, Flexible PCB, Long FPC, FPC Assembly, Rigid-Flex PCB, Multilayer PCB, High Frequency PCB, Alunimium PCB
Registered Capital 2000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias Contact Now	Quick View 6L PCB Enig Technologies for Telecom/Server/POS Industry Contact Now	Quick View 6layer 1.0mm Thickness Enig, Min. Pad 4mil PCB Fabrication for Industry Am/FM Radio/DVD Contact Now	Quick View 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module Contact Now	High Quality Multilayer PCB Assembly/PCB Manufacturer in China Contact Now

Transaction Info
	Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias Contact Now	Quick View 6L PCB Enig Technologies for Telecom/Server/POS Industry Contact Now	Quick View 6layer 1.0mm Thickness Enig, Min. Pad 4mil PCB Fabrication for Industry Am/FM Radio/DVD Contact Now	Quick View 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module Contact Now	High Quality Multilayer PCB Assembly/PCB Manufacturer in China Contact Now
Price	US $ 5.60-7.30/ Piece	US $ 0.325-9.80/ Piece	US $ 0.29-8.70/ Piece	US $ 0.36-9.50/ Piece	US $ 0.5/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	-	Ts16949	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand(KMC)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; PCB Testing: E-Testing; Flying Probe Testing; Shipping: DHL, UPS, TNT, FedEx, etc;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Layer Count: 4-64layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Min. Trace Width/Space: 3/3mil; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Brand: 11; Layer Count: 4-64layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Min. Trace Width/Space: 3/3mil; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4-64layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Min. Trace Width/Space: 3/3mil; Standard: Ipc II;	Type: Multilayer Board; Dielectric: Fr4 Cem1 Cem3 Pi Flex-Rigid Al Cu etc; Flame Retardant Properties: V0; Mechanical Rigid: Flex Flex-Rigid Rigid; Base Material: Copper; Guangdong: Shenzhen;
Supplier Name	Keep Moving Circuits Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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