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US$0.10-2.00 / Piece

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High Quality Printed Circuit Board 4 Layer High Difficulty PCB Hsal Lf for Electronics Product Project pictures & photos

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What is High Quality Printed Circuit Board 4 Layer High Difficulty PCB Hsal Lf for Electronics Product Project

Name: High Quality Printed Circuit Board 4 Layer High Difficulty PCB Hsal Lf for Electronics Product Project
Uploaded: 2024-10-22T18:22:39+08:00
Description: Company Presentation KEEP MOVING CIRCUITS CO., LTD(KMC) was founded in August, 2000, a hi-tech group enterprise now, Shen Zhen factory is located at Fuyong Town, Bao'an District,mainly produce sample

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-2.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Not Specified
Transport Package by Vacuum Packing in Cartons
Trademark KMC
Origin Shenzhen
Min. Hole Size 0.2mm
Min. Line Width&Spacing 3mil/4mil
Certificates UL, RoHS, SGS, ISO9001 ISO14000
Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Company Presentation KEEP MOVING CIRCUITS CO., LTD(KMC) was founded in August, 2000, a hi-tech group enterprise now, Shen Zhen factory is located at Fuyong Town, Bao'an District,mainly produce sample and quick-turn up to middle volume PCB orders. Since 2011, for supporting all customers better ...

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Keep Moving Circuits Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCBA, PCB+Assembly, FPC, Flexible PCB, Long FPC, FPC Assembly, Rigid-Flex PCB, Multilayer PCB, High Frequency PCB, Alunimium PCB
Registered Capital 2000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

4 Layer PCB Comparison

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Transaction Info
	High Quality Printed Circuit Board 4 Layer High Difficulty PCB Hsal Lf for Electronics Product Project Contact Now	Quick View OEM ODM PCBA Manufacturer Printed Circuit Board One Stop PCB Assembly Service Contact Now	Quick View High Tg Fr4 HDI Multilayer PCB Printed Circuit Board Contact Now	Quick View Electronic Circuit Board PCB Turnkey Services 94 V0 LED Aluminum PCB Board Contact Now	Quick View Multi-Layer PCBA Contract Manufacturing with SMT DIP Technology PCBA Assembly Contact Now
Price	US $ 0.10-2.00/ Piece	US $ 2.01-5.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.56-5.00/ Piece	US $ 0.76-5.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM, Own Brand(KMC)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Not Specified; Min. Hole Size: 0.2mm; Min. Line Width&Spacing: 3mil/4mil; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; Shipping: DHL, UPS, TNT, FedEx, etc;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Keep Moving Circuits Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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