Multilayer Circuit Board PCB Generator Main Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.50-5.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL Lead-Free
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Not Specified
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen Guangdong
  • Material Type Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
  • Layer Counts 1--30
  • Board Thickness 0.2mm--6.0mm
  • Fished Outer Copper 1oz--5oz
  • Minimum Trace Width 3mil/4mil
  • Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;

Product Description

Product De Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 ...

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Generator Main Board Comparison
Transaction Info
Price US $ 2.50-5.50/ Piece Negotiable US $ 0.01-0.08/ Piece US $ 0.01-0.08/ Piece US $ 0.01-0.08/ Piece
Min Order 1 Pieces 5 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, Paypal L/C, Paypal L/C, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 - ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million - US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM, Own Brand(KMC) - OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Ckmcu;
Sku: 9068;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Supplier Name

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chipskey Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier