| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Not Specified;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Surface Finishing: Immersion Gold, Immersion Silver, OSP, Hal, Hal Lf;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 2.84;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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