| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminium;
Base Material: Aluminum;
Insulation Materials: Aluminium;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Not Specified;
Solder Mask: White, Black;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Aluminium Core PCB;
Flame Retardant Properties: 94V-0;
Dielectric: Aluminum Core PCB;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: LED, Lamp, Lighting;
Mechanical Rigid: Aluminum Substrate PCB;
Material: Aluminum;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 18um, 35um, 70um, 105um, 140um;
Minimum Hole: 3/3mil;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Thermal Conductivity: 1W, 2W, 2.5W, 3W, 8W, 12W;
PCB Thickness: 0.4~3.6mm;
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Type: Single Sided PCB;
Flame Retardant Properties: 94V-0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics, Communications, Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Customized;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Other Service: ODM, OEM, Final Product Assembling;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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