PCB
US$5.50-6.30 / Piece
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What is Enig, HASL PCB Circuits Manufacturing with High Quality Rigid-Flex Printed Circuit Board PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$5.50-6.30 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen
  • Min. Hole Size 0.2mm
  • Min. Line Width&Spacing 3mil/4mil
  • Certificates UL, RoHS, SGS, ISO9001 ISO14000
  • Shipping DHL, UPS, TNT, FedEx, etc
  • Soldermask Green, Blue, White, Black, Yellow, Red
  • Silkscreen White, Black

Product Description

KEEP MOVING CIRCUITS CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2014,the core business are Multilayer(including HDI) middle up to high volume PCB orders ,High Frenquency ...

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PCB Comparison
Transaction Info
Price US $ 5.50-6.30/ Piece US $ 4.95-16.80/ Piece US $ 0.635-5.79/ Piece US $ 0.62-3.78/ Piece US $ 0.896-5.36/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM, Own Brand(KMC) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Structure: Multilayer PCB+FPC;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Supplier Name

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier