Custom Multilayer Print Circuit Board 3D Module PCB Manufacture and OEM PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-50.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Inner Vacuum Packing, Outer Carton
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
  • Layer 1-32
  • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
  • Max Production Size 600*800mm

Product Description

1. Design and produce single-sided, double-sided, and multi-layer PCB/PCBA, with competitive prices, high quality, and good service; 2. CEM-1, CEM-3, FR-4, FR-4 high TG, aluminum based materials can be choosed; 3. Surface treatment methods include HAL, HAL lead-free, gold/silver/tin plating, ...

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Multi-Layer PCB/PCBA Circuit Board Comparison
Transaction Info
Price US $ 1.00-50.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.70-3.70/ PCS
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 PCS
Payment Terms L/C, T/T, D/P, Paypal T/T T/T T/T L/C, T/T, Western Union
Quality Control
Product Certification - - - - ISO, UL, RoHS,CE,IATF
Management System Certification - ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$5 Million - US$10 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
Supplier Name

KTB Jilin Technology Co., Ltd.

Gold Member

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier