New Product PCBA Design/PCB Software Develop Software Development

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-50.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Inner Vacuum Packing, Outer Carton
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
  • Layer 1-32
  • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
  • Max Production Size 600*800mm

Product Description

1. Design and produce single-sided, double-sided, and multi-layer PCB/PCBA, with competitive prices, high quality, and good service; 2. CEM-1, CEM-3, FR-4, FR-4 high TG, aluminum based materials can be choosed; 3. Surface treatment methods include HAL, HAL lead-free, gold/silver/tin plating, ...

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Multi-Layer PCB/PCBA Circuit Board Comparison
Transaction Info
Price US $ 1.00-50.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 1.20-1.80/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$5 Million - US$10 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 16;
Board Thickness: 3.2mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: Controlled Impedance;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Supplier Name

KTB Jilin Technology Co., Ltd.

Gold Member

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier