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OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design pictures & photos

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What is OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design

Name: OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design
Uploaded: 2024-05-08T20:26:48+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI PCB Structure Comparison

	Quick View OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design Contact Now	Quick View Customized PCB Design and Manufacturing Service by Leading Experts Contact Now	Quick View PCB & PCBA Assembly Manufacturer Printed Circuit Board PCBA OEM Service Other PCBA Contact Now	Quick View Ceramic Base Material PCB Circuit Board China Printed Circuit Board Assemble Factory Ceramic PCB Contact Now	Quick View Customized PCB Assembly Service: Prototypes, Custom Design, Gerber Support Contact Now

Transaction Info
	Quick View OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design Contact Now	Quick View Customized PCB Design and Manufacturing Service by Leading Experts Contact Now	Quick View PCB & PCBA Assembly Manufacturer Printed Circuit Board PCBA OEM Service Other PCBA Contact Now	Quick View Ceramic Base Material PCB Circuit Board China Printed Circuit Board Assemble Factory Ceramic PCB Contact Now	Quick View Customized PCB Assembly Service: Prototypes, Custom Design, Gerber Support Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.15-9.98/ Piece	US $ 1.50-3.50/ PCS	US $ 0.10-0.50/ Piece	US $ 0.15-9.98/ Piece
Min Order	1 Pieces	1 Pieces	1 PCS	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union	L/C, T/T, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	ISO, UL, RoHS,CE,IATF	-	-
Management System Certification	-	-	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM	OEM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; Min Annular Ring: 0.05mm/0.05mm; Layer Counts: 1L-40L; HASL/Lf Hal: 2.5um; Copper Weight: 0.5--6 Oz;	Type: PCBA; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersional Gold; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Ucreate PCB; Board Thickness: 1.2~2.0mm; Surface Finihsing: Immersional Gold; Lead Time: 6-8 Working Days; PCB Testing: E-Testing; Flying Probe Testing; Mask Ink Color: White/Black/Green/Red/Yellow/Blue; Color: Green/Yellow/Black/White/Red/Blue; Number of Layers: Multilayer; Copper Thickness: 0.5-7.0oz; Condition: Original Made;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: UC; Layer: 12; Thickness: 0.96mm; Soldmask: Green; Surface: Plated Gold; Silkscreen: White; Certificates: UL, ISO, Ts16949; Hole Quantity Per PCS: 1200; Min Line Width/ Space: 0.1/0.1mm; Use: Electronic Production; Panel: 6PCS/Set;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; Min Annular Ring: 0.05mm/0.05mm; Layer Counts: 1L-40L; HASL/Lf Hal: 2.5um; Copper Weight: 0.5--6 Oz;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Dongguan Chenlu Electronics Co., Ltd.	Ucreate PCB Co., Ltd.	Ucreate PCB Co., Ltd.	Dongguan Chenlu Electronics Co., Ltd.
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