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OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design pictures & photos

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What is OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design

Name: OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design
Uploaded: 2024-05-08T20:26:48+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB Assembly, Bare PCB Board, PCB and Silkscreen Stencil, Alu Frame Printing Mesh, Sewing Machine, Printing Machine, Packing Machine, Test Machine, Food Machine, Light
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI PCB Structure Comparison

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Transaction Info
	OEM ODM Fr4 Printed Circuit Board Multilayer Assembly Plated Gold 16layer Odb++ File Multilayer RF PCB Design Contact Now	Quick View Multilayer Printed Circuit Board RoHS 94V0 PCB Circuit Board Fabrication Contact Now	Multilayer PCB for Bluetooth Keyboard Contact Now	94V0 PCB for Timer Relay PCB with Factory Price Contact Now	1.6mm 1oz Copper PCB for Battery PCB Protection Circuit Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 5/ Piece	US $ 2.00-4.50/ Piece	US $ 1.50-2.80/ Piece	US $ 1.50-3.50/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	-	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand(KX)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Base Material: Fr4; Surface Finishing: Immsion Gold/ HASL/ OSP; Copper Thickness: 35-105um; Board Thickness: 0.2-1.6mm; Min. Hole Size: 0.15mm; Min. Line Wigth: 0.25mm; Min. Line Spacing: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask Type: Green; Silkscreen: White; Certificates: UL, RoHS, SGS, ISO9001; Shipping: DHL, UPS, TNT, FedEx, etc; Min. Hole Size: 0.25mm; Min. Line Width: 0.15mm; Min. Line Spacing: 0.15mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask Type: Green; Silkscreen: White; Certificates: UL, RoHS, SGS, ISO9001; Shipping: DHL, UPS, TNT, FedEx, etc; Min. Hole Size: 0.25mm; Min. Line Width: 0.15mm; Min. Line Spacing: 0.15mm; Surface Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask Type: Green; Silkscreen: White; Certificates: UL, RoHS, SGS, ISO9001; Shipping: DHL, UPS, TNT, FedEx, etc; Min. Hole Size: 0.25mm; Min. Line Width: 0.15mm; Min. Line Spacing: 0.15mm; Surface Treatment: Immersion Gold;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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