Ceramic PCB Manufacturing Process
US$0.19-9.99 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.19-9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric AIN
  • Material Ain
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aln, Al2O3
  • Insulation Materials Aln, Al2O3
  • Model PCB
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification During 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Shape Rectangular, Round, Slots, Cutouts, Complex
  • Surface Treatment Enig, Enepig, Immersion Silver
  • PCB Testing E-Test, Fly Probe Test, Visual Checking
  • Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
  • Copper Thickness 0.5-12oz(18-420um)
  • Board Thickness 0.2-6.0mm
  • Min. Line Width 0.075mm(3mil)
  • Min. Line Spacing 0.075mm(3mil)
  • Min Width of Annular Ring 0.15mm(6mil)
  • Outline Tolerance(mm) 0.05mm
  • Hole Tolerance 0.05mm
  • Soldermask Color White, Green, Black

Product Description

Ceramic pcb Capability. Board Thickness(mm) 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm Layer Number 1-2L Base copper thickness(um) 18-300um(0.5-8.5oz) Min Track width/space(mm) 0.075mm Min hole size 0.06mm(PTH) Finished hole tolerance(mm) 0.05mm(NPTH) Outline Tolerance(mm) 0.05mm ...

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Ceramic PCB Manufacturing Process Comparison
Transaction Info
Price US $ 0.19-9.99/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT T/T T/T T/T T/T
Quality Control
Management System Certification - ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe
Annual Export Revenue US$1 Million - US$2.5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM, ODM, Own Brand(KX) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
Soldermask Color: White, Green, Black;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier