HDI Rigid Flex PCB

US$0.10-10.00 / Piece

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Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board pictures & photos

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What is Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board

Name: Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board
Uploaded: 2024-09-30T10:54:06+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB Assembly, Bare PCB Board, PCB and Silkscreen Stencil, Alu Frame Printing Mesh, Sewing Machine, Printing Machine, Packing Machine, Test Machine, Food Machine, Light
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI Rigid Flex PCB Comparison

	Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board Contact Now	#10A064 Pic K150 Programmer Microchip Pic Microcontroller Microchip USB Downloader Burner Contact Now	#33003 Atmega328p WiFi Esp8266 Development Board with 32MB Memory USB-Ttl CH340g Module for Arduino Uno R3 Contact Now	Quick View One Stop PCB & PCBA Manufacturing with OEM Components Service Contact Now	Quick View Electronic Multilayer Monitor PCBA Circuit Board Manufacturer in China Contact Now

Transaction Info
	Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board Contact Now	#10A064 Pic K150 Programmer Microchip Pic Microcontroller Microchip USB Downloader Burner Contact Now	#33003 Atmega328p WiFi Esp8266 Development Board with 32MB Memory USB-Ttl CH340g Module for Arduino Uno R3 Contact Now	Quick View One Stop PCB & PCBA Manufacturing with OEM Components Service Contact Now	Quick View Electronic Multilayer Monitor PCBA Circuit Board Manufacturer in China Contact Now
Price	US $ 0.10-10.00/ Piece	Negotiable	Negotiable	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece
Min Order	1 Pieces	5 Pieces	5 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay
Quality Control
Product Certification	-	-	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485
Management System Certification	-	-	-	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	US$1 Million - US$2.5 Million	-	-	Above US$100 Million	Above US$100 Million
Business Model	OEM, ODM, Own Brand(KX)	-	-	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-	-	-
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Brand: Chipskey; Sku: 10A064; Place of Origin: China; MOQ: 5; Delivery Time: 7days; Support Customization: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Chipskey; Sku: 33003; Place of Origin: China; MOQ: 5; Delivery Time: 7days; Support Customization: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Chipskey Technology Co., Ltd.	Shenzhen Chipskey Technology Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.
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