BGA Test PCB

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What is Custom North America and Austrilia PCB Design Company 24 Hours Feedback Ulti-Layer Pcbs Manufacturer

Name: Custom North America and Austrilia PCB Design Company 24 Hours Feedback Ulti-Layer Pcbs Manufacturer
Uploaded: 2024-05-09T20:18:17+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

BGA Test PCB Comparison

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Transaction Info
	Quick View Custom North America and Austrilia PCB Design Company 24 Hours Feedback Ulti-Layer Pcbs Manufacturer Contact Now	Quick View PCB Prototyping for Research and Development Projects Flex-Rigid PCB Board Designs for Miniature Devices Contact Now	Quick View Professional Multilayer PCB Circuit Board PCB Manufacturing for LED Lighting Systems Contact Now	Quick View Multilayer PCB Design Custom Made Circuit Board PCB for Power Electronics Devices Contact Now	Quick View 6layer. Advanced PCB Design and Fabrication and PCBA for Aerospace Electronics with SMT Technology Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union
Quality Control
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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