Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layers: 32 Layers;
Min Track / Spacing: 0.075 mm / 0.075 mm;
Min Hole Size: 0.10 mm;
Min Pad Size: 0.35 mm;
Rigid-Flex Thickness: 0.25 mm-6.0 mm;
Max Copper Thickness: 5 Oz;
Max Wpnl Size: 610 mm X 914 mm;
Finish Copper(Flex Part): 0.5-2 Oz;
Finish Copper(Rigid Part): 1-5 Oz;
Surface Finish: Enig, OSP, Immersion Silver, HASL, Caborn, Enepig;
Drilling Accuracy: +/-0.05 mm;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
PCB Max Size: 400*310mm;
PCB Min Size: 20*10mm;
PCB Thickness: 0.4~1.5mm;
Impedance: 50~120 Ohm;
Hole Min Diameter: 0.1mm;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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