Copper Inlay PCB
US$0.10-10.00 / Piece
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What is One Stop Service 3W 1W High Power LED with 20mm Star Base Plate Panel Circuit Board PCB Aluminium LED

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Structure Metal Base Rigid PCB
  • Dielectric Aluminum
  • Material Metal
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Aluminum
  • Insulation Materials Metal Composite Materials
  • Brand Kxpcba
  • Transport Package Inner Vacuum, Carton Box
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Layer Quantity 1-4
  • PCB Size 300*1200mm
  • Thermal Conductivity (ω/M-K) 1-12W/Mk
  • Board Thickness 0.8-6mm
  • Min Tracing/Spacing 4mil / 4mil
  • Pth Size Min 0.2mm
  • Npth Size Min 0.8mm
  • Copper Thickness 1-5oz
  • Solder Mask Any
  • Surface Finish HASL, OSP, Enig, Hard Gold, Enepig
  • Countersinks, Castellated Holes Yes
  • Certification ISO9001, UL

Product Description

As a professional and reliable supplier with more than ten years of expertise in the manufacturing of Aluminum printed circuit boards, KXPCB can manufacture single-layer Alu PCB and 2 Layer / double sided Aluminum PCB. We are able to supply you with small, medium, or mass production at a reasonable ...

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Copper Inlay PCB Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.38-3.20/ Piece US $ 0.29-2.90/ Piece US $ 0.43-2.80/ Piece US $ 0.67-4.90/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, XT T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification ISO9001, UL - - - -
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Counterbore Hole: 6.0mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Solder Bridge: 4mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Counterbore Hole: 6.0mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Indutrial/Power Supply;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Other: Tg180;
Pad in Via: 0.2mm;
BGA to Line: 3mil;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier