Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
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Type: 4 Layer OSP PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.15mm/0.15mm;
Solder Mask Color: Blue/Green/Black/White/Red/Yellow;
Surface Finishing: Immersion Gold, Immersion Silver, OSP, Hal, Hal Lf;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Multilayer Fr4 PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Multilayer Fr4 PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: 4 Layer Gold Finger PCB;
Dielectric: FR-4;
Material: Fr4;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Surface Finishing: Immersion Gold, Immersion Silver, OSP, Hal, Hal Lf;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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