Multilayer USB Charger PCB

US$0.10-10.00 / Piece

View

Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB pictures & photos

Recommend for you
What is OEM High Quality Fr4 94V0 CCTV Board Camera Module Assembly 0.5-3.2mm Thickness Copper 1oz-4oz 4 Layer Rogers Printed Circuit Board
What is Multilayer Fr-4 Blind and Buried Hole BGA Immersion Gold Circuit Board HDI PCB Market with Impedance Test Coupon
What is High Definition Silkscreen Gold Plating Halogen Free Fr4 High CTI HDI PCB Quote with Reasonable Price

What is Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB

Name: Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB
Uploaded: 2024-05-09T19:56:14+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

Learn More

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Multilayer USB Charger PCB Comparison

	Quick View Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB Contact Now	Quick View Four Layer PCB Board for Automation Equipments Contact Now	Quick View 230V Mobile Phone Charger PCB with 12W Double USB Charger Contact Now	Quick View Custom PCBA Board Design Fr4 Rigid PCB in Shenzhen Factory Contact Now	Quick View Engineering OEM Manufacturer Inverter Prototype Cloning High Frequency PCB Contact Now

Transaction Info
	Quick View Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB Contact Now	Quick View Four Layer PCB Board for Automation Equipments Contact Now	Quick View 230V Mobile Phone Charger PCB with 12W Double USB Charger Contact Now	Quick View Custom PCBA Board Design Fr4 Rigid PCB in Shenzhen Factory Contact Now	Quick View Engineering OEM Manufacturer Inverter Prototype Cloning High Frequency PCB Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 1.36-1.38/ Piece	US $ 0.28-1.88/ Piece	US $ 0.28-1.88/ Piece	US $ 0.28-1.88/ Piece
Min Order	1 Pieces	10 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	T/T	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	-	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: OSP;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green,Black,Blue,Red,Yellow,White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production,PCB Assembly,Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green,Black,Blue,Red,Yellow,White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production,PCB Assembly,Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green,Black,Blue,Red,Yellow,White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production,PCB Assembly,Components Sourcing;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.
Select All

Contact Now

Hot Search