Specification |
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Rogers/Cem1-3/Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
Certificates: ISO9001, IATF16949, ISO13485;
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