Water Cooling Machine Antspace HK3 for S19 S21 Hyd Hydro-Cooling Computer Server Exchanger Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$7,999.00-8,999.00 / Piece

Sepcifications

  • Graphics Card Water Cooling Mining Container
  • Video Memory Capacity ≥2GB
  • Interface Type PCI Express 3.0 16X
  • Video Memory Type Gddr 6
  • Output Type VGA
  • Memory Bus 192 Bit
  • Bus Standard PCI-E 16X
  • Heat Dispatch Method Fan HeatSink
  • 3D API DirectX 10.1
  • Transport Package Package Per Box
  • Specification 195 x 290 x 370mm
  • Trademark Bitmain
  • Origin China
  • Model S21
  • Hydro Water Cooling
  • S21 Hyd 335t
  • Newest Model S21

Product Description

Water Cooling Machine ANTSPACE HK3 For S19 S21 Hyd Hydro-cooling Computer Server Exchanger Machine Product Description Specifications Model: S21 Hyd 335TH/s ± 3% power on wall:5360W± 5% Power efficiency on wall :16J/TH ± 5% Power supply AC input voltage:200~240Volt ...

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S19 Hydro Comparison
Transaction Info
Price US $ 7,999.00-8,999.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, USDT/USDC L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Water Cooling Mining Container;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: Gddr 6;
Output Type: VGA;
Memory Bus: 192 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 10.1;
Model: S21;
Hydro: Water Cooling;
S21 Hyd: 335t;
Newest Model: S21;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Supplier Name

Shenzhen Letine Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier