Die Bonding Machine
US$50,000.00-99,999.00 / Piece
View
  • Recommend for you
  • What is Multiple Chips and Suction Nozzle Dispensing Eutectic Crystal Planting Free Combination Machine Die Bonder
  • What is Semiconductor Equipment Automatic Wafer Mounter Dicing Saw
  • What is Semiconductor Industry Wafer Fab IC Optical Communication LED Mems Laboratory Manual Dicing Saw

What is Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$50,000.00-99,999.00 / Piece

Sepcifications

  • After-sales Service 1 Year
  • Condition New
  • Speed High Speed
  • Precision Precision
  • Certification CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crate
  • Trademark minder-hightech
  • Origin China

Product Description

Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments Line Automatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC360 MD-JC380 MD-JC360i MD-JC380i MDAX64DI MD-1412 Automatic loading and ...

Learn More

Die Bonding Machine Comparison
Transaction Info
Price US $ 50,000.00-99,999.00/ Piece US $ 2899/ Piece US $ 13999/ Piece US $ 1,700.00-1,714.29/ Piece US $ 48,000.00-50,000.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Money Gram
Quality Control
Product Certification CE CE ISO RoHS -
Management System Certification - ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 - ISO 9001, QC 080000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia, Africa North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$1 Million - US$2.5 Million US$5 Million - US$10 Million US$5 Million - US$10 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model Own Brand(minder-hightech) ODM, Own Brand(NeoDen) ODM, Own Brand(NeoDen) Own Brand(CNHOLY) OEM, Own Brand(Meraif), hanwha, yamaha ,juki, fuji, panasonic
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
After-sales Service: 1 Year;
Condition: New;
Speed: High Speed;
Precision: Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
After-sales Service: Spares, Warranty and Life-Long Customers Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: Medium-speed Chip Mounter;
Nozzle-Head Qty: 2;
Nozzle Changer: Yes;
Vibration Feeder: Yes;
Support: Reel Tape, Bulk Components, IC, LED, 0201;
Displace: 3;
Smallest Size: 0201;
Largest Size: 18X 18mm;
Max Height: 12mm, Support Big Cap;
PCB Size Max.: (249-315)Mmx 350mm;
Power: 50W;
N.W.: 35.5kgs;
After-sales Service: 2 Years;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Max Speed: 1,4000cph;
Average Speed: 9000cph for Drive Board;
Nozzle Head: 6;
Vision: Flying Vision System;
Feeder Qty: 53PCS (If 8mm);
Packing Size: 1241*903*1562mm;
Smallest Component: Imperial 0201;
Max PCB Width: 300mm;
Max PCB Length: 800mm;
After-sales Service: Online;
Condition: New;
Speed: Super High Speed;
Precision: Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Electric Current: AC;
Product Name: Acf Bonding Machine;
Model: Hw-1911 Two Lower Cameras Version;
Frequency: 50-60 Hz;
Power Supply: 200W;
Net Weight: 67kg;
Applicable Industries: Cellphone Camera Repair;
Package: Professional Box;
After Sales Service Provided: Online Support;
After Warranty Service: 1 Year;
Local Service Location: None;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Board Size(1): 50X70W-510X460lmm;
Board Size(2): 50X70W-535X590lmm;
Board Size(3): 50X70W-535X330lmm;
Board Thickness 1: 0.4mm - 6.0mm;
Height Resolution: 12um (5um-17.5um Option);
Inspection Speed: 3~5 Fov/Sec;
CCD: 9.1m Digital Camera (5m,12m Digital Camera Option);
Bottom Clearance: Upper:35mm Lower:50mm;
Weight: Approx.734kg;
Dimension W X D X H: 1,000X1,170X1,800mm;
Supplier Name

Guangzhou Minder-Hightech co.,Ltd

Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Haoli Techonology Co., Ltd

Diamond Member Audited Supplier

MERAIF LIMITED

Gold Member Audited Supplier