Eutectic Bonding Machine

US$9,999.00-99,999.00 / Piece

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Multi-Chip High Precision Fully Automatic Loading and Unloading Placement Eutectic Die Bonder Eutectic Bonding Machine pictures & photos

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What is Multi-Chip High Precision Fully Automatic Loading and Unloading Placement Eutectic Die Bonder Eutectic Bonding Machine

Name: Multi-Chip High Precision Fully Automatic Loading and Unloading Placement Eutectic Die Bonder Eutectic Bonding Machine
Uploaded: 2025-03-10T16:05:06+08:00
Description: Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine Suitable for the packaging process of high-precision multi chip SMT; Suitable for bonding substrates and chips in COB/COC

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9,999.00-99,999.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed High Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Case
Trademark minder-hightech
Origin China

Product Description

Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine Suitable for the packaging process of high-precision multi chip SMT; Suitable for bonding substrates and chips in COB/COC processes, through adhesive solidification process and heating eutectic process; Linear dual ...

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Guangzhou Minder-Hightech co.,Ltd

Diamond Member Since 2017

Audited Supplier

Business Range Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery, Service
Year of Establishment 2014-12-30
Registered Capital 147802.18 USD
Main Markets North America, Europe

Eutectic Bonding Machine Comparison

	Multi-Chip High Precision Fully Automatic Loading and Unloading Placement Eutectic Die Bonder Eutectic Bonding Machine Contact Now	Quick View 6 Head SMT SMD Pick and Place Machine (NeoDen9) for PCB Prototype and SMT Assembly with Ball Screw 53 Feeders Fly Camera Contact Now	Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment Contact Now	Wedge Bonder Semiconductor Wire Bonding Device Semiconductor Aluminum Wire Welding Machine Contact Now	Precision Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer Contact Now

Transaction Info
	Multi-Chip High Precision Fully Automatic Loading and Unloading Placement Eutectic Die Bonder Eutectic Bonding Machine Contact Now	Quick View 6 Head SMT SMD Pick and Place Machine (NeoDen9) for PCB Prototype and SMT Assembly with Ball Screw 53 Feeders Fly Camera Contact Now	Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment Contact Now	Wedge Bonder Semiconductor Wire Bonding Device Semiconductor Aluminum Wire Welding Machine Contact Now	Precision Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer Contact Now
Price	US $ 9,999.00-99,999.00/ Piece	US $ 13999/ Set	Negotiable	Negotiable	US $ 90,000.00-1,500,000.00/ Piece
Min Order	1 Pieces	1 Sets	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T	T/T	T/T
Quality Control
Product Certification	CE	CE	RoHS, CE	RoHS, CE	-
Management System Certification	-	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$5 Million - US$10 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	Own Brand(minder-hightech)	ODM, Own Brand(NeoDen)	-	-	-
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 6; Feeder Qty: 53; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max PCB Size: 300mm800mm;* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: Free Training; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Product Name: Clip Bonder Machine; Two Options: Vacuum and Flat Furnace;	After-sales Service: Free Training; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Product Name: Wedge Bonder Device; Feature: Graphical Editor,Multi-Segment Bonding; Item Number: as-EV;	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;
Supplier Name	Guangzhou Minder-Hightech co.,Ltd	Zhejiang NeoDen Technology Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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