Latest Mini LED Place PCB Assembly Automatic Placement Chip Mounter Assemble Line pictures & photos

Latest Mini LED Place PCB Assembly Automatic Placement Chip Mounter Assemble Line

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Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

After-sales Service After Sales Service
Condition New
Speed Super High Speed
Precision High Precision
Certification CCC, ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type Ultra High-speed Chip Mounter
Transport Package Plastic Film, Ply Box or Wood Frame Package
Specification 2630(L)*1130(W)*2100(H)mm
Trademark MOJE
Origin Guangzhou, China

Product Description

Product Description Description of advantages: Application with mounting by mode of double head and double working area, the speed reaches the fastest in the line. High precision compensation system is adopted to realize precision compensation and correction in device mounting motion. ...

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Guangdong Moje Intelligent Equipment Co., Ltd.

Gold Member Since 2023

Audited Supplier

Rating & Reviews： 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products pick and place machine; SMT whole line; solder paste printer and reflow welder
Number of Employees 151
Year of Establishment 2013-12-24
Management System Certification ISO9001:2015, ISO14001:2015, ISO45001:2018 certificate
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

SMT Comparison

	Latest Mini LED Place PCB Assembly Automatic Placement Chip Mounter Assemble Line Contact Now	Quick View Photonics Packaging Eutectic Bonding Machine Die Attach Equipment Contact Now	Quick View Automatic Molding Machine for High Power Lasers Epoxy Dispensing Equipment Contact Now	Quick View High Power Lasers Die Attach Epoxy Machine Contact Now	Quick View China Die Attach Machine for Chip Packaging Contact Now

Transaction Info
	Latest Mini LED Place PCB Assembly Automatic Placement Chip Mounter Assemble Line Contact Now	Quick View Photonics Packaging Eutectic Bonding Machine Die Attach Equipment Contact Now	Quick View Automatic Molding Machine for High Power Lasers Epoxy Dispensing Equipment Contact Now	Quick View High Power Lasers Die Attach Epoxy Machine Contact Now	Quick View China Die Attach Machine for Chip Packaging Contact Now
Price	Negotiable	US $ 250,000.00-450,000.00/ Piece	US $ 100,000.00-300,000.00/ Piece	US $ 100,000.00-300,000.00/ Piece	US $ 250,000.00-450,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	T/T	T/T	T/T	T/T
Quality Control
Product Certification	CCC, ISO, CE	-	-	ISO, CE	-
Management System Certification	ISO 14001	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	Domestic	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1 Month(s)	-	-	-	-
Product Attributes
Specification	After-sales Service: After Sales Service; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 500 N (Max); Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable); Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe; Uph: up to 10,000 Pieces Per Hour (Max);	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: Plusmn; 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;
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