PCBA

US$1.16-1.66 / Piece

View

Good Price Custom PCBA Circuit Board PCB Assembly PCB PCBA Manufacturer pictures & photos

Recommend for you
What is Mustar Electronic Multilayer Enig PCBA Assembly Manufacturer From Shenzhen
What is Mustar New and Original Integrated Circuits IC Chip IC Bom List From Shenzhen Electronic Components
What is Electronic PCBA Board Service PCB Assembly in China

What is Good Price Custom PCBA Circuit Board PCB Assembly PCB PCBA Manufacturer

Name: Good Price Custom PCBA Circuit Board PCB Assembly PCB PCBA Manufacturer
Uploaded: 2023-04-14T10:35:31+08:00
Description: Good Price Custom Pcba Circuit Board PCB Assembly PCB PCBA Manufacturer Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Fil

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.16-1.66 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand Mustar
Transport Package ESD Bag, Bubble Pack
Specification standard
Trademark Mustar
Origin China
Certificate ISO9001/RoHS/ISO14001/ISO13485/Ts16949
Testing Service Aoi,X-ray,Function Test
Color Yellow Blue Green Black White
Service 24 Hours Technical Services

Product Description

Good Price Custom Pcba Circuit Board PCB Assembly PCB PCBA Manufacturer Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm Max.Copper ...

Learn More

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Number of Employees 35
Year of Establishment 2021-12-16
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

	Quick View Good Price Custom PCBA Circuit Board PCB Assembly PCB PCBA Manufacturer Contact Now	Quick View Rigid-Flex PCB Board 94V-0 RoHS 0.2mm Thickness Multilayer Flex Circuits PCB with America DuPont Material Contact Now	Quick View Shenzhen OEM Car Multilayer PCBA 94V0 RoHS PCBA Board SMD Electronic Service HDI PCB Any Layer with Reasonable Price Contact Now	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now	Quick View Multilayer Fr-4 Blind and Buried Hole BGA Immersion Gold Circuit Board HDI PCB Market with Impedance Test Coupon Contact Now

Transaction Info
	Quick View Good Price Custom PCBA Circuit Board PCB Assembly PCB PCBA Manufacturer Contact Now	Quick View Rigid-Flex PCB Board 94V-0 RoHS 0.2mm Thickness Multilayer Flex Circuits PCB with America DuPont Material Contact Now	Quick View Shenzhen OEM Car Multilayer PCBA 94V0 RoHS PCBA Board SMD Electronic Service HDI PCB Any Layer with Reasonable Price Contact Now	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now	Quick View Multilayer Fr-4 Blind and Buried Hole BGA Immersion Gold Circuit Board HDI PCB Market with Impedance Test Coupon Contact Now
Price	US $ 1.16-1.66/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Product Certification	ISO9001/RoHS/ISO14001/ISO13485/Ts16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Mustar; Testing Service: Aoi,X-ray,Function Test; Color: Yellow Blue Green Black White; Service: 24 Hours Technical Services;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
Select All

Contact Now

Hot Search