Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 0.075mm;
Min Space Width: 0.075mm;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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Layers: 1-24layers;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
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Layers: 1-24layers;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 0.075mm;
Min Space Width: 0.075mm;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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