Electronics Component
US$0.50-1.00 / Piece
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What is Mustar One Stop OEM PCBA Assembly Gerber File Bom List Electronics Circuit Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$1.00

50-99 Pieces US$0.80

100-499 Pieces US$0.70

500-999 Pieces US$0.60

1,000+ Pieces US$0.50

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Carton
  • Specification unlimited
  • Trademark Mustar
  • Origin Shenzhen
  • Shape DIP
  • Conductive Type Bipolar Integrated Circuit
  • Integration Gsi
  • Technics Semiconductor IC
  • D/C Standard
  • Warranty 2 Years
  • Mounting Type Standard, SMT, DIP
  • Cross Reference Standard
  • Memory Type Standard

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD Our Advantages 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component ...

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Electronics Component Comparison
Transaction Info
Price US $ 0.50-1.00/ Piece US $ 0.1/ Piece US $ 1.00-20.00/ Piece US $ 0.90-99.99/ Piece US $ 2.31-2.68/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO, UL
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, Own Brand(Bicheng) OEM, ODM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: HASL;
Min Hole Diameter: 0.25mm;
Min Track Width: 0.1mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Tin;
Mode of Production: Laser Cut;
Layers: Double-Layer;
Base Material: Stainless Steel Shim;
Customized: Customized;
Condition: New;
Structure: Stencil Foils, Aluminum Framed;
Foil Thickness: 0.12mm;
Aperture Configured: Laser Cut;
Appearance: Engraving and Electro Polishing;
Advantages1: a) High Precision Dimension;;
Advantages2: B) Good Shape on The Window;;
Advantages3: C) Hole Wall Is Smoother.;
Fiducial Mark: Through Hole;
Application: Csp, BGA, 0.5mm Qfp etc. Package;
Metal Coating: Silver;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

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