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US$1.15-1.71 / Piece

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Custom New Energy Electronic Printed Circuit Boards PCB& PCBA Manufacturer in Shenzhen pictures & photos

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What is Custom New Energy Electronic Printed Circuit Boards PCB& PCBA Manufacturer in Shenzhen

Name: Custom New Energy Electronic Printed Circuit Boards PCB& PCBA Manufacturer in Shenzhen
Uploaded: 2023-04-24T16:55:46+08:00
Description: Custom New Energy Electronic Printed Circuit Boards PCB& PCBA Manufacturer In Shenzhen Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free F

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.15-1.71 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand Mustar
Transport Package ESD Bag, Bubble Pack
Specification standard
Trademark Mustar
Origin China
Certificate ISO9001/RoHS/ISO14001/ISO13485/Ts16949
Testing Service Aoi,X-ray,Function Test
Color Yellow Blue Green Black White
Service 24 Hours Technical Services

Product Description

Custom New Energy Electronic Printed Circuit Boards PCB&PCBA Manufacturer In Shenzhen Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm ...

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Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Number of Employees 35
Year of Establishment 2021-12-16
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

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Transaction Info
	Quick View Custom New Energy Electronic Printed Circuit Boards PCB& PCBA Manufacturer in Shenzhen Contact Now	Quick View PCBA Assembly Standby Power Consumption Low Alarm System Smoke Detector PCBA Manufacturer Contact Now	Quick View Multilayer PCB Design Prototype Printed Circuit Board PCBA Box Building Contact Now	Quick View Double Sided Printed Circuit Boards Assembly Wtil RoHS UL Contact Now	Quick View Multilayer Immersion Gold Printed Circuit Board PCB with 100% Electrical Test Contact Now
Price	US $ 1.15-1.71/ Piece	US $ 0.89-5.00/ Piece	US $ 0.76-5.00/ Piece	US $ 0.15-15.00/ Piece	US $ 0.15-15.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	ISO9001/RoHS/ISO14001/ISO13485/Ts16949	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Mustar; Testing Service: Aoi,X-ray,Function Test; Color: Yellow Blue Green Black White; Service: 24 Hours Technical Services;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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