| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Board Thickness: 1.6mm;
Surface Treament: Immersion Gold;
Solder Mask: Blue Matt,Ksm-6189blm1;
Legend: White,Taiyo;
Min Line Width (Mil): 5.2 Mil;
Min Line Spacing (Mil): 4.3 Mil;
Electrical Test: 100% PCB Passed;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
Solderability Test: 245ºC 5s 1 Cycle;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Board Thickness: 1.6mm;
Surface Treament: HASL Lead Free;
Solder Mask: Green,Ijr-4000 MW300;
Legend: White,Ijr-4000 MW300;
Min Line Width (Mil): 6.2 Mil;
Min Line Spacing (Mil): 6.3 Mil;
Electrical Test: 100% PCB Passed;
Visual Inspection: Ipc-a-600h&Ipc-6012c;
Solderability Test: 245ºC 5s 1 Cycle;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Inner Layer Cu Thickness: 1 Oz;
Pth Cu Thickness: 22.3 Um;
Surface Cu Thickness: 35.5 Um;
Finished Thickness: 1.62mm;
Surface Treatment: Enig;
Solder Mask: Green, Nan Ya, Lp-4G G-05;
Legend: White, Tai Yo, S-380W;
Trace Width (mm): 0.255mm;
Spacing (mm): 0.376mm;
Warp and Twist: 0.21%;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Finished Thickness: 1.62 mm;
Pth Cu Thickness: 22. 52um;
Inner Layer Cu Thickness: 35 Um;
Surface Cu Thickness: 43.8um;
Surface Finish: Lead- Free HASL;
Solder Mask: Green,Nan Ya,Lp-4G G-05;
Legend: White,Tai Yo,S-380W;
Electrioal Test: 100% Pass;
V-Cut Thickness: 0.39mm;
Solder Abllity Test: 100% Wetting;
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