| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Final Height of PCB: 1.6mm;
Surface Finish: Immersion Gold (Enig);
Solder Mask Color: Gloss Green;
Colour of Component Legend: White;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3/3.8mm;
Inner Copper Thick: 1 Oz;
Via: BGA Pacakged and Via Tented;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Final Height of PCB: 1.6mm;
Surface Finish: Immersion Gold;
Via: BGA Package and Via Tented;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Space: 3 Mil/4 Mil;
Minimum / Maximum Holes: 0.3/4.9mm;
Inner Copper Thick: 1 Oz;
Test: 100% Electrical Test Prior Shipment;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1.5 Oz;
Final Height of PCB: 1.6mm;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Space: 4 Mil/4 Mil;
Minimum / Maximum Holes: 0.25/9.0mm;
Via: Ball Grid Array (BGA) Package with Via Capped.;
Inner Copper Thick: 1 Oz;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1oz;
Final Height of PCB: 1.92mm;
Surface Finish: Electroless Nickel Immersion Gold (Enig);
Solder Mask Color: Green, Psr-2000gt600d, Taiyo Supplied.;
Colour of Component Legend: White, Ijr-4000 MW300, Taiyo Supplied.;
Minimum Trace and Space: 4 Mil/5 Mil;
Minimum / Maximum Holes: 0.25/5.0mm;
Via: Vin in Pad Under BGA Package;
Test: 100% Electrical Test Prior Shipment;
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