High Quality Good Customer Service Custom Electronic Assembly PCB PCBA Multilayer PCB Electronic Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$3.10-8.90 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China

Product Description

Product Parameters Packaging &Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL LIMITED (Hereafter called NEW CHIP) is a professional agent and distributor of electronic ...

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Ics Chip Comparison
Transaction Info
Price US $ 3.10-8.90/ Piece US $ 0.16-0.26/ Piece US $ 0.58-6.26/ Piece US $ 0.41/ Piece US $ 0.45/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification - UL, RoHS, CCC, ISO - - -
Management System Certification ISO 9001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue US$1 Million - US$2.5 Million - - US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Test: Aoi X-ray;
MOQ: 1PCS;
Payment: T/T, W.U. , Paypal;
File: Gerber File, Cam, PCB;
Function: Accept Customization;
Package: Vacuum Packaging+Bubble Bag+Carton;
Service: Custom;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Tech: Buried Blind Via;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 35 Um;
Innner Copper Thick: 1/1 Oz;
Final Height of PCB: 1.6+/-0.16%mm;
Surface Finish: Enig,Nickel ≧120u'' ,Gold ≧1.2u'';
Solder Mask Color: Green;
Colour of Component Legend: White;
Via: Via Tented.;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 35 Um;
Innner Copper Thick: 1/1 Oz;
Final Height of PCB: 2.0+/-10%mm;
Surface Finish: Enig,Nickel 100u'',Gold ≧2u'';
Solder Mask Color: Green;
Colour of Component Legend: White;
Test: 100% Electrical Test Prior Shipment;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier