Raspberry Pi 4 Fan, Low-Profile CPU Cooler with RGB Cooling Fan and Heatsink for Model B & 3b+ 3 (Silver) Manufacturing PCBA OEM Video

Name: Raspberry Pi 4 Fan, Low-Profile CPU Cooler with RGB Cooling Fan and Heatsink for Model B & 3b+ 3 (Silver) Manufacturing PCBA OEM
Uploaded: 2022-09-23T20:27:59+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.30

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series,...
Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

	Raspberry Pi 4 Fan, Low-Profile CPU Cooler with RGB Cooling Fan and Heatsink for Model B & 3b+ 3 (Silver) Manufacturing PCBA OEM Contact Now	Quick View Custom Rigid-Flexible PCB Board 2/4/6/8/10PCBA Assembly Manufacturer Multilayer Printed Circuit Board Contact Now	Quick View Industrial Control Software High Performance Processor WiFi Bluetooth 4G Full Netcom Ethernet Test Tool Circuit Board Contact Now	Quick View Air Cooler Remote Control Audio Module Audio Player Circuit Board Battery Charger USB PCB Contact Now	Quick View Multilayer Fr-4 Electronics 94V0 RoHS PCB High Tg Electronic PCB with Best Quality Contact Now

Transaction Info
	Raspberry Pi 4 Fan, Low-Profile CPU Cooler with RGB Cooling Fan and Heatsink for Model B & 3b+ 3 (Silver) Manufacturing PCBA OEM Contact Now	Quick View Custom Rigid-Flexible PCB Board 2/4/6/8/10PCBA Assembly Manufacturer Multilayer Printed Circuit Board Contact Now	Quick View Industrial Control Software High Performance Processor WiFi Bluetooth 4G Full Netcom Ethernet Test Tool Circuit Board Contact Now	Quick View Air Cooler Remote Control Audio Module Audio Player Circuit Board Battery Charger USB PCB Contact Now	Quick View Multilayer Fr-4 Electronics 94V0 RoHS PCB High Tg Electronic PCB with Best Quality Contact Now
Price	US $ 0.30-10.00/ Piece	US $ 0.01-0.08/ Piece	US $ 0.01-0.08/ Piece	US $ 2.00-5.00/ Piece	US $ 2.50-2.80/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, Paypal	L/C, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001	ISO 9001	-	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM, ODM, Own Brand()	OEM, ODM, Own Brand()	-	OEM, ODM, Own Brand(KMC)
Average Lead Time	-	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Organic Resin; Min. Hole Size: 0.2mm; Min. Line Width&Spacing: 0.1mm/0.1mm; Surface Finish: Immersion Gold / HASL+Lead Free; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; Shipping: DHL, UPS, TNT, FedEx, etc;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Finest Printed Circuit Board Ltd.	Keep Moving Circuits Co., Ltd.
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