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What is OEM ODM Design Manufacturer PCBA Rigid PCB Fr4

Name: OEM ODM Design Manufacturer PCBA Rigid PCB Fr4
Uploaded: 2023-08-02T10:14:26+08:00
Description: Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptabl

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Price

Min. Order Reference FOB Price

2 Pieces US$0.50-8.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Communication
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand New Chip
Transport Package Vacuum Packaging, Carton Box
Specification FR-4 SILICON COMPONENTS
Trademark New Chip
Origin China
Soldermask Color Green, Yellow, Blue, Black, White...
Sample Available
OEM/ODM Available
Certificate Gurantee Yes
Test 100%E-Testing
Color of Silk Screen Green, Purple, Black
Service OEM / Dfm

Product Description

Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

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Shenzhen New Chip international Ltd

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

	Quick View OEM ODM Design Manufacturer PCBA Rigid PCB Fr4 Contact Now	Multilayer PCB Printed Circuit Board with Enig Surface Finish Made in Shenzhen Contact Now	Quick View RoHS Multilayer Printed Circuit Board PCB Made of Fr4 Tg170 with Immersion Gold Contact Now	Quick View 6 Layer PCB Printed Circuit Board Module Made of Fr4 Tg150 with 2 U" Immersion Gold Contact Now	Customized Immersion Gold Circuit Board PCB Manufacturing, 94V0 RoHS PCB Board Contact Now

Transaction Info
	Quick View OEM ODM Design Manufacturer PCBA Rigid PCB Fr4 Contact Now	Multilayer PCB Printed Circuit Board with Enig Surface Finish Made in Shenzhen Contact Now	Quick View RoHS Multilayer Printed Circuit Board PCB Made of Fr4 Tg170 with Immersion Gold Contact Now	Quick View 6 Layer PCB Printed Circuit Board Module Made of Fr4 Tg150 with 2 U" Immersion Gold Contact Now	Customized Immersion Gold Circuit Board PCB Manufacturing, 94V0 RoHS PCB Board Contact Now
Price	US $ 0.50-8.00/ Piece	US $ 0.10-0.50/ piece	US $ 0.01-100.00/ pcs	US $ 0.10-100.00/ piece	US $ 0.10-0.50/ piece
Min Order	2 Pieces	1 piece	1 pcs	1 piece	1 piece
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union	T/T, Western Union, Paypal, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Green; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Immersion Gold; Solder Mask: Red; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Blue; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Green; Legend: White; Mini Hole: 0.1mm; Mini Line Width: 0.1mm; Mini Space Trace: 0.1mm;
Supplier Name	Shenzhen New Chip international Ltd	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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