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US$1.40-5.00 / Piece
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What is Integrated Circuits Tea1733t/N1 of 118 Instruments Ti IC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$3.00

1,000+ Pieces US$1.40

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric CEM-3
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Layer 1-32 Layers
  • Service OEM/ODM
  • OEM/ODM Available
  • Test 100%E-Testing
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea
  • Surface Treatmen OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes

Product Description

Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

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PCB Comparison
Transaction Info
Price US $ 1.40-5.00/ Piece US $ 0.10-1.00/ Piece US $ 1.95-2.10/ Piece US $ 0.60-0.65/ Piece US $ 0.10-1.00/ Piece
Min Order 1 Pieces 1 Pieces 10 Pieces 10 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union L/C, T/T, Western Union T/T T/T L/C, T/T, Western Union
Quality Control
Management System Certification ISO 9001, IATF16949 ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe - - South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Gdm, Nouya, Rogers, etc.;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Gdm, Nouya, Rogers, etc.;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Supplier Name

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier