| Specification | 
                                    
                                                                                     Type: Flexible Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy Resin + Polyimide Resin;
 Application: Consumer Electronics;
 Flame Retardant Properties: V2;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Copper;
 Insulation Materials: Epoxy Resin;
 
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                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Copper;
 Insulation Materials: Organic Resin;
 Brand: Kevis;
 Products Name: PCBA Assembly PCB Electronic Motherboard;
 Layer: Single / Double Sided / Multilayer;
 Service: PCB/PCBA/PCB Assembly/Electronic Parts;
 Other Service: Layout Design,Engineering Support,Testing;
 Specialised: Medical,Industrial,Communication,Controlboard,LED;
 PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
 Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
 Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
 Min.Hole Size: 0.1mm (4 Mil);
 Board Thickness: 0.2mm-7mm;
 Min.Line Spacing: 0.1mm (4 Mil);
 Solder Color: Green, Red, White, Black,Yellow,Blue;
 SMT Assembly Line: 10 Lines;
 Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
 
 | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Copper;
 Insulation Materials: Organic Resin;
 Brand: Kevis;
 Products Name: PCBA Assembly PCB Electronic Motherboard;
 Layer: Single / Double Sided / Multilayer;
 Service: PCB/PCBA/PCB Assembly/Electronic Parts;
 Other Service: Layout Design,Engineering Support,Testing;
 Specialised: Medical,Industrial,Communication,Controlboard,LED;
 PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
 Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
 Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
 Min.Hole Size: 0.1mm (4 Mil);
 Board Thickness: 0.2mm-7mm;
 Min.Line Spacing: 0.1mm (4 Mil);
 Solder Color: Green, Red, White, Black,Yellow,Blue;
 SMT Assembly Line: 10 Lines;
 Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
 
 | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Copper;
 Insulation Materials: Organic Resin;
 Brand: Kevis;
 Products Name: PCBA Assembly PCB Electronic Motherboard;
 Layer: Single / Double Sided / Multilayer;
 Service: PCB/PCBA/PCB Assembly/Electronic Parts;
 Other Service: Layout Design,Engineering Support,Testing;
 Specialised: Medical,Industrial,Communication,Controlboard,LED;
 PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
 Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
 Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
 Min.Hole Size: 0.1mm (4 Mil);
 Board Thickness: 0.2mm-7mm;
 Min.Line Spacing: 0.1mm (4 Mil);
 Solder Color: Green, Red, White, Black,Yellow,Blue;
 SMT Assembly Line: 10 Lines;
 Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
 
 | 
                                    
                                                                                     Type: Multilayer PCB;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Fr4, Tg, Cem-1, Aluminium;
 Insulation Materials: Organic Resin;
 Brand: Smart;
 Copper Thickness Tolerance: +-0.250z;
 Min Drill Hole Diameter: 0.010.1mm or 10 Mil;
 Umber of Layers: 4-Layer;
 Number of Layer: 1, 2, 4, 6, up To24 Layers;
 Min Trace/Gap: 0.075mmor3 Mil;
 Single Gross Weight: Kg;
 Silk Screen: White, Black;
 Board Size: 1200 mm*600mm Max;
 Board Thickness: 0.2-4.0mm;
 Silk Screen Min Line Width: 0.006or0.15mm;
 
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