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Professional OEM PCB Provider Intelligent Security PCB Manufacturer Industrial PCBA

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Price

Min. Order Reference FOB Price

2 Pieces US$0.30-4.30 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. Board ...

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Shenzhen New Chip international Ltd

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

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Transaction Info
	Professional OEM PCB Provider Intelligent Security PCB Manufacturer Industrial PCBA Contact Now	Quick View Integrated BMS 48V Circuit Board Assembly PCBA for Electric Vehicle Chargers Contact Now	Quick View LED PCB PCB Assembly Board PCB for Medical Wearables Contact Now	Quick View PCB Factory Thick Copper Pcbs for Power Electronics Contact Now	Quick View Heavy Copper PCB PCB for Consumer Electronics Products DIP Assembly for Electronic Control Units Contact Now
Price	US $ 0.30-4.30/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece
Min Order	2 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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