Stm32f103c8t6 Arm Stm32 Lqfp48 Microcontroller Stm32f103 IC Stm32f103c8t6

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China

Product Description

Product Parameters Packaging &Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL LIMITED (Hereafter called NEW CHIP) is a professional agent and distributor of electronic ...

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Ics Chip Comparison
Transaction Info
Price US $ 0.10-0.50/ Piece US $ 0.11-9.90/ Square Meter US $ 2.50-5.50/ Piece US $ 10.00-18.00/ Piece US $ 2.50-5.50/ Piece
Min Order 1 Pieces 1 Square Meters 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, D/P, Western Union, Paypal L/C, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal, Money Gram, Cash L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification - - - ISO, RoHS, Reach, UL, CQC -
Management System Certification ISO 9001, IATF16949 ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$1 Million - US$2.5 Million US$50 Million - US$100 Million US$10 Million - US$50 Million US$50 Million - US$100 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, ODM, Own Brand() OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(KMC)
Average Lead Time - Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Copper Thickness: H/H0z-5/50z;
Board Thickness: 0.3mm - 3.2mm;
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
Maximum Layer: 20;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier