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US$0.03-10.00 / Piece

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Simple Single Layer/1 Layer PCB Circuit Board with Low Cost pictures & photos

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What is Simple Single Layer/1 Layer PCB Circuit Board with Low Cost

Name: Simple Single Layer/1 Layer PCB Circuit Board with Low Cost
Uploaded: 2023-10-11T16:16:44+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB Fr-4, High Tg Fr$, Halogen Free
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

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Transaction Info
	Quick View Simple Single Layer/1 Layer PCB Circuit Board with Low Cost Contact Now	Quick View Made in China Shenzhen Okey Circuit Multilayer PCB Copper Set Custom-Made Multilayer OEM PCB Contact Now	Quick View China OEM High Quality Rigid PCB Board Manufacturer PCB Board with RoHS Contact Now	Quick View 15 Year Factory Electronic PCBA Assembly Manufacturer Multilayer Printed Circuit Board PCB Contact Now	Quick View Experienced PCB Montherboard Service Electronic Printed Circuit Board Designing PCB Factory Contact Now
Price	US $ 0.03-10.00/ Piece	Negotiable	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	1 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T	T/T
Quality Control
Product Certification	-	ISO9001, ISO14000, Ts16949.UL.RoHS	ISO/CQC/IATF/UL/RoHS	ISO/CQC/IATF/UL/RoHS	ISO/CQC/IATF/UL/RoHS
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: OEM ODM; Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg; Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG; Layer: 1-60 Layers; Service: Turnkey Assembly PCB Service; Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui; Copper Thickness: 1-10oz; Min. SMD Size: 01005; QA Inspection: Aoi, X-ray, Ict; Order Qty: No Limited; Condition: New; Controlling Range: -40c~125c; Solder Resist Color: Green;Red;Yellow;Black;White; Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask; Trade Mark: OEM, ODM;	Type: Fr4; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: No Brand; Layer: 1 to 20; Board Thickness: Board Thickness; Finished Inner Copper Thickness: H/H0z-4/40z;	Type: Fr4; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: No Brand; Layer: 1 to 20; Board Thickness: Board Thickness; Finished Inner Copper Thickness: H/H0z-4/40z;	Type: Fr4; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: No Brand; Layer: 1 to 20; Board Thickness: Board Thickness; Finished Inner Copper Thickness: H/H0z-4/40z;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Okey Circuit Co., Ltd.	Jian Unice Pcb Technique Co., Ltd	Jian Unice Pcb Technique Co., Ltd	Jian Unice Pcb Technique Co., Ltd
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