What is PCB PCBA High-Quality Ome PCB Assembly Design EMS Service Manufacture

Name: PCB PCBA High-Quality Ome PCB Assembly Design EMS Service Manufacture
Uploaded: 2023-10-11T16:18:43+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Conductive Type Unipolar Integrated Circuit
Integration GSI
Technics Thick Film IC
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea
shape Flat

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

	PCB PCBA High-Quality Ome PCB Assembly Design EMS Service Manufacture Contact Now	Quick View Mitsubishi IGBT Module Models Are Complete Contact Now	Quick View Starpower IGBT Module Original Stock Supply Contact Now	Quick View Factory Channel for Integrated Circuits (ICs) Linear Ltc2051cms8#Trpbf Ltc2236cuh#Trpbf Ltc2630csc6-Lz12#Trpbf Ltc2480cms#Pbf Contact Now	Quick View AMD Ryzen 7 CPU Processor 65W 7nm L3=32m 100-000000071 100-000000158 100-000000284 100-000000168 Contact Now

Transaction Info
	PCB PCBA High-Quality Ome PCB Assembly Design EMS Service Manufacture Contact Now	Quick View Mitsubishi IGBT Module Models Are Complete Contact Now	Quick View Starpower IGBT Module Original Stock Supply Contact Now	Quick View Factory Channel for Integrated Circuits (ICs) Linear Ltc2051cms8#Trpbf Ltc2236cuh#Trpbf Ltc2630csc6-Lz12#Trpbf Ltc2480cms#Pbf Contact Now	Quick View AMD Ryzen 7 CPU Processor 65W 7nm L3=32m 100-000000071 100-000000158 100-000000284 100-000000168 Contact Now
Price	US $ 0.03-10.00/ Piece	Negotiable	Negotiable	US $ 0.10-0.30/ Piece	US $ 0.10-0.30/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1000 Pieces	100 Pieces
Payment Terms	T/T, D/P, Western Union, Paypal	T/T	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, IATF16949	-	-	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	-	-	North America, Eastern Europe, Eastern Asia, Western Europe	North America, Eastern Europe, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	-	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	-	-	-	-
Average Lead Time	-	-	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Conductive Type: Unipolar Integrated Circuit; Integration: GSI; Technics: Thick Film IC; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; shape: Flat;	Conductive Type: Bipolar Integrated Circuit; Integration: GSI; Operating Temperature: 0℃ - 70℃; Shape: DIP; Technics: Semiconductor IC;	Conductive Type: Bipolar Integrated Circuit; Integration: GSI; Operating Temperature: 0℃ - 70℃; Shape: DIP; Technics: Thick Film IC;	Conductive Type: Standard; Integration: SSI; Technics: Semiconductor IC;	Conductive Type: Unipolar Integrated Circuit; Integration: GSI; Technics: Semiconductor IC;
Supplier Name	Shenzhen New Chip international Ltd	Jiangsu Core Drill Age Electronic Technology Co., Ltd	Jiangsu Core Drill Age Electronic Technology Co., Ltd	Emi International (Hk) Co. Ltd	Emi International (Hk) Co. Ltd
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