| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Product Name: Turnkey PCB Assembly Services;
Quality Grade: Ipca610;
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: Fr4, Cem1-Cem3, Rogers, Aluminum Copper;
Older Resist Color: Green;Red;Yellow;Black;White;
Qty: No MOQ;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
Design: PCB Design, PCB Layout, PCB Clone;
PCBA Layer: 1-32 Layers;
Copper Thickness: 18um-210um(6oz);
OEM Service: PCB Manufacturing, Compoments Sourcing, PCB Assemb;
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