Hxw MCU 32bit 512kb Stm32 Microcontroller IC Flash Stm32f407 Stm32f407vet6

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 - 0.60 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China

Product Description

Product Parameters Packaging &Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL LIMITED (Hereafter called NEW CHIP) is a professional agent and distributor of electronic ...

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Transaction Info
Price US$0.10 - 0.60 / Piece US$2.00 - 5.00 / Piece US$2.00 - 5.00 / Piece US$2.00 - 5.00 / Piece US$2.00 - 5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Europe Europe Europe Europe
Annual Export Revenue - 59,508,592 RMB 59,508,592 RMB 59,508,592 RMB 59,508,592 RMB
Business Model ODM, OEM OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier