PCBA Service
US$2.50-15.50 / Piece
PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services pictures & photos
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What is PCBA PCB Circuit Board Contract Manufacturing with Electronic Board Services

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$15.50

500+ Pieces US$2.50

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fr4
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Grandtop
  • Transport Package High Quality Carton Box Outside with Bubble Bag in
  • Origin China
  • Sourcing 1 Electronic Contract Manufacturing 20210130

Product Description

PCBA PCB Electronic Circuit Board Contract Manufacturing Services Grandtop is certified with ISO9001, ISO13485 ( for Medical device) , IATF16949 for Automotive Electronics. Our service : PCB Capability: Article Description Capability Sercive PCB and SMT assembly with one-stop ...

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Transaction Info
Price US $ 2.50-15.50/ Piece US $ 0.18-0.30/ Piece US $ 0.37-0.57/ Piece US $ 5.10-5.12/ Piece US $ 0.37-0.57/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - - CCC, ISO9001, RoHS, UL/SGS CCC, ISO9001, RoHS, UL/SGS -
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: one month		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Sourcing 1: Electronic Contract Manufacturing 20210130;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: Green, Blue, Black, Red, White;
Surface Treatment: Enig;
Mini Hole: 0.1mm;
Mini Trace: 0.1mm;
Supply: Fast;
Service: One-Stop;
MOQ: 1 PCS;
Layers: Mutilayers;
Shipping Type: Shipping Type;
Payment: Paypal, Tt, Western Union;
File: PCB File;
Lead Time: ±0.10mm;
Type: The Piston Pin, Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard Component: Standard Component;
Technics: SMT/DIP;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Type: The Piston Pin, Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard Component: Standard Component;
Technics: SMT/DIP;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Conductive Type: Unipolar Integrated Circuit;
Integration: Ulsi;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Shape: Round;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

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