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US$1.00-12.80 / Piece

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What is Custom Power Bank PCBA Board Assembly PCB Manufacturer

Name: Custom Power Bank PCBA Board Assembly PCB Manufacturer
Uploaded: 2021-09-30T17:38:06+08:00
Description: Custom Power Bank PCBA Board Assembly PCB Manufacturer Who we are? Shenzhen Grandtop Automation Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI)

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Price

Min. Order Reference FOB Price

1 Piece US$1.00-12.80 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Complex
Application Industrial PCBA
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Aluminum
Insulation Materials Organic Resin
Brand Gt
Transport Package Packed in Carton
Specification Copper
Trademark GT
Origin China
PCBA-Testing X-ray, Aoi
Small Order Acceptable
Type Rigid Circuit Board
Applications PCBA Board

Product Description

Custom Power Bank PCBA Board Assembly PCB Manufacturer Who we are? Shenzhen Grandtop Automation Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers. We have ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Business Range Apparel & Accessories, Auto, Motorcycle Parts & Accessories, Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Manufacturing & Processing Machinery, Security & Protection, Service
Main Products Yes
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025
Terms of Payment T/T
OEM/ODM Availability Yes

PCB Comparison

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Transaction Info
	Quick View Custom Power Bank PCBA Board Assembly PCB Manufacturer Contact Now	Quick View Epoxide Woven Glass Fabric Epoxy Resin Fr4 Copper Clad Laminate PCB Board Contact Now	Quick View 100*585 Copper King Field/OEM Vacuum Packaging PCB for Printer Head Board Contact Now	Quick View Vacuum Packaging Subtractive Process One Sided Copper Sheets Rigid PCB Circuit Boards Contact Now	Quick View Electrolytic Foil Epoxide Woven Glass Fabric Laminate CCTV PCB Rigid Circuit Boards Contact Now
Price	US $ 1.00-12.80/ Piece	US $ 0.95-2.00/ Piece	US $ 0.95-1.00/ Piece	US $ 0.95-2.00/ Piece	US $ 1.00-1.90/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Complex; Application: Industrial PCBA; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Gt; PCBA-Testing: X-ray, Aoi; Small Order: Acceptable; Type: Rigid Circuit Board; Applications: PCBA Board;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shenzhen Grandtop Electronics Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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