PCB
US$1.00-30.00 / Piece
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What is Multilayer PCB 94V0 Welding Machine Circuit Board PCB Prototype Jlc PCB Pbc Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-30.00 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Packed in Carton
  • Specification Copper
  • Trademark GT
  • Origin China
  • PCBA-Testing X-ray, Aoi
  • Small Order Acceptable
  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Material Complex
  • Applications Electronic Manufacturing Service

Product Description

Multilayer PCB 94v0 Welding Machine Circuit Board PCB Prototype JLC PCB PBC Board Who we are? Shenzhen Grandtop Automation Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for ...

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PCB Comparison
Transaction Info
Price US $ 1.00-30.00/ Piece Negotiable US $ 20/ Piece US $ 0.89-5.00/ Piece US $ 0.87-7.00/ Piece
Min Order 1 Pieces 1 Pieces 100 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, Paypal L/C, 50%T/T L/C, 50%T/T T/T T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification RoHS, ISO RoHS, ISO, ISO13485,IATF16949 RoHS, ISO, ISO13485,IATF16949 RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Applications: Electronic Manufacturing Service;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier