Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.3mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Min. Hole Size: 0.25mm;
Min. Line Spacing: 0.1mm/4mil;
Rated Power: 45W-50W;
Control Mode: Foc;
Transmission Type: IR;
Current: 3.0-3.3AMP;
Board Thickness: 1.6mm;
Min. Line Width: 0.1 0mm;
Surface Finishing: HASL;
MCU: Fu6831L Big IC;
Speed Adjustment: Wall Control/Remote Control;
Max. Speed: 300-380 Rpm;
Diameter of Middle Hole: 25mm;
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