Specification |
Metal Coating: Silver;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01005;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Conformal Coating: Epoxy Resin;
SMT Process: Machine Made;
Pth Wall: 20um;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Aluminum Board;
Customized: Customized;
Condition: New;
Layer: 1 Layer;
Raw Material: Aluminum Base, Copper Base;
Copper Thickness: 2oz;
Pth Wall: 20um Min;
Thermal Conductivity: 1W/M.K;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: Kb;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 1-8oz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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