Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: PCB Assembly;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB Fabrication, PCB Assembly, Box Build;
Applicaton: Industrial Device, Medical, LED, New Energy;
Service: Customized, ODM, OEM;
Conformal Coating: Yes;
PCBA Programming: Yes;
PCBA Testing: Yes;
Packaging Service: Yes;
Process: DIP, SMT;
|
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: PCB Board Assembly;
Quality: Reliable & High Quality;
Service: One Stop OEM Services Provided;
Price: Factory Direct Price Competitive and Transparent;
|
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Wireless Charging PCB Assembly;
Quality: Reliable & High Quality;
Service: One Stop OEM Services Provided;
Price: Factory Direct Price Competitive and Transparent;
|
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: PCB Assembly;
Quality: Reliable & High Quality;
Service: One Stop OEM Services Provided;
Price: Factory Direct Price Competitive and Transparent;
|
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: PCB Board Assembly;
Quality: Reliable & High Quality;
Service: One Stop OEM Services Provided;
Price: Factory Direct Price Competitive and Transparent;
|