Development Board
US$59.90-65.90 / Piece
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What is Customized Android System Mainboard with GPS, Speaker, and Mic for Embedded Systems

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$59.90-65.90 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Rockchip
  • Maximum Memory Capacity 8G
  • Structure ATX
  • Memory DDR2
  • SATA Interface SATA3.0
  • CPU Socket LGA 775
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
  • Specification Customized
  • Trademark customized
  • Origin Shenzhen, China
  • Name PCBA Assembly Manufacturing
  • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
  • Advantages PCB Design/Assembly, PCBA & EMS
  • Good Services SMT, BGA and DIP
  • Production Type SMT & DIP & Assembling & Testing
  • Certificate UL94V-0+RoHS
  • Services OEM&ODM Manufacturer Since 2005
  • Item Control Board PCBA

Product Description

Product Description Factory Rockchip RK3288 ARM Android Lunix Motherboard Development Board Function &Interface Detailed Description CPU RK3288 Cortex-A17 quad-core, up to 1.8GHz DDR DDR-III 2GB (4GB optional) Storage The default comes with an 8GB EMMC NAND chip that can scale up to ...

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Development Board Comparison
Transaction Info
Price US $ 59.90-65.90/ Piece US $ 20.00-50.00/ Piece US $ 25.00-45.00/ Piece Negotiable Negotiable
Min Order 5 Pieces 1 Pieces 50 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, OA L/C, T/T, D/P, Western Union, Paypal, OA L/C, T/T, D/P, Western Union, Paypal, OA
Quality Control
Product Certification UL94V-0+RoHS - - - -
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Africa, Mid East, Eastern Asia North America, South America, Africa, Mid East, Eastern Asia North America, South America, Africa, Mid East, Eastern Asia North America, South America, Africa, Mid East, Eastern Asia
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM - - - -
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR2;
SATA Interface: SATA3.0;
CPU Socket: LGA 775;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Micro ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Socket 988;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
CPU: 2ND 3rd Gen;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: LGA1151;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR2;
SATA Interface: SATA2.0;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
CPU: LGA775;
PCB Color: coffee;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: LGA1151;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Chipset: Intel B250/H310c/B360 Chipset;
Slots: 1 X Pcie 3.0/2.0 X16 Slot;
Storage: 4 X SATA 6GB/S Ports;
Dimension: 195 X 168mm;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen ITZR Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen ITZR Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen ITZR Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen ITZR Technology Co., Ltd.

Diamond Member Audited Supplier