Electronic Component
US$2.00 / Piece
View

Wemos D1 Esp8266 Wi-Fi Board 80-160MHz Iot D1-Uno Development Board Module Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$2.00 / Piece

Sepcifications

  • Type Module Board
  • Dielectric FR-4
  • Material Customised
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Model PCB
  • Transport Package Standard
  • Specification Standard
  • Trademark Original
  • Origin Original
  • Quality High
  • Lead Time 0-10days
  • Microcontroller Esp-8266 32-Bit
  • Clock Speed 80MHz and up to 160MHz
  • USB Converter CH340g
  • Operating Voltage 3.3V
  • Flash Memory 4MB
  • Digital I/O 11
  • Communications I2c, Serial, Spi
  • WiFi Built-in

Product Description

WEMOS D1 ESP8266 Wi-Fi Board 80-160MHz IoT D1-UNO development board module Provide bom serice/Contact for more component TYPE DESCRIPTION Category Module board Product Status Active Type Factory manufacturer Q1: What services do you offer? We provide turnkey solutions including R&D, PCB ...

Learn More

Electronic Component Comparison
Transaction Info
Price US $ 2/ Piece US $ 0.13/ Piece US $ 0.5/ Piece US $ 0.068-1.968/ Piece US $ 1.00-50.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification GMP ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Module Board;
Dielectric: FR-4;
Material: Customised;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Model: PCB;
Quality: High;
Lead Time: 0-10days;
Microcontroller: Esp-8266 32-Bit;
Clock Speed: 80MHz and up to 160MHz;
USB Converter: CH340g;
Operating Voltage: 3.3V;
Flash Memory: 4MB;
Digital I/O: 11;
Communications: I2c, Serial, Spi;
WiFi: Built-in;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Base Material: Fr4;
Surface Finishing: Immersion Gold;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Solder Mask Type: Green;
Silkscreen Color: White;
Test: Aoi;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Copper Thickness: 1oz;
Layer: Double Sides;
Min. Hole Size: 0.2mm;
Min. Line Space: 0.12mm;
Min. Line Width: 0.12mm;
Test: Aoi;
Surface Finishing: Enig;
Solder Mask Type: Green;
Package: Vacuum Package;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Soldermask: Green;
Silkscreen: White;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Board Thickness: 1.6mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Base Material: Fr4;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
PCB Solder Mask: Green;
PCB Silk Screen: White;
Pack: Vacuum Packing;
Supplier Name

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier