Integrated Circuits Board
US$0.01-0.41 / Piece
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What is Factory Design and Assembly Service Rigid Multi-Layer Product ODM and PCBA Manufacture

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.41 / Piece

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material G-10
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Inner Vacuum Packing and Outer by Cartons
  • Specification FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
  • Trademark OKEY
  • Origin Guangdong Shenzhen, China
  • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
  • Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
  • Layer 1-60 Layers
  • Service Turnkey Assembly PCB Service
  • Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
  • Copper Thickness 1-10oz
  • Min. SMD Size 01005
  • QA Inspection QA Inspection and Ect.
  • Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
  • Order Qty No Limited
  • Controlling Range -40c~125c
  • Solder Resist Color Green;Red;Yellow;Black;White and Ect.
  • Surface Finishedc HASL, Gold Finger, OSP, Enig, Peelable Mask
  • Trade Mark OEM, ODM
  • Conditions New

Product Description

Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...

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Integrated Circuits Board Comparison
Transaction Info
Price US $ 0.01-0.41/ Piece US $ 0.50-1.00/ Piece US $ 0.50-1.00/ Piece US $ 4.00-5.00/ Piece US $ 4.00-5.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T T/T
Quality Control
Product Certification RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO ISO ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - - North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia
Annual Export Revenue US$5 Million - US$10 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
- - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: G-10;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Conditions: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Layers: 1-24layers;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Layers: 1-24layers;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Supplier Name

Shenzhen Okey Circuit Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier