Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 4mil;
Max Production Size: 600*800mm;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
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Type: Rigid Circuit Board;
Dielectric: Fr-4 with Tg of 135°c;
Material: Fr-4 (Glass Epoxy From Iteq);
Application: Bluetooth Transmitters;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold (32.1% ) 0.05µm Over 3;
Base Material: Fr-4 Substrate with Via in Pad Technology;
Insulation Materials: Tg135°c Fr-4;
Brand: Iteq;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: RO4350b (Woven Glass Reinforced Hydrocarbon/Cerami;
Application: RF Identification Tags;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enepig;
Base Material: RO4350b Laminate with RO4450f Bondply;
Insulation Materials: RO4350b and RO4450f;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Fr-4 with Tg ≥ 170°c;
Material: Fr-4 (From Shengyi);
Application: USB Wireless Adapters;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Fr-4 (From Shengyi);
Insulation Materials: Fr-4 Epoxy Resin;
Brand: Shengyi;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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