Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: 2022+;
Mode of Production: 2022+;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Customized: Customized;
Condition: New;
Inductance: 6.5μh;
Certificate Standard: Compatible with Qi Standards;
Work Frequency: 100-205kHz;
Dimension: 40*68mm;
Application: Vehicle Smartphone Holder Power Bank;
Charging Power: 15W Max;
Charging Efficiency: 84% Max;
Charging Distanc: 5-8mm;
Charging Protocol: Has Passed The EPP Qi2.0 Certif;
Protection Functio: Overcurrent, Overvoltage, Shortcircuit, Temperatu;
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